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AGILE ANALOG MAKES THE ANALOG PARTS OF SOC DESIGN EASY PEASY LEMON SQUEEZY

by Max Maxfield - May 16, 2023

I sometimes joke that I’d bend over backwards to be flexible and that I’d give
my right arm to be ambidextrous (I didn’t say they were good jokes). Now,
following a recent excursion into wibbly-wobbly analog space (where no one can
hear you scream), I’m tempted to say that I’d jump through hoops to be more
agile.

I … Read More → "Agile Analog Makes the Analog Parts of SoC Design Easy Peasy
Lemon Squeezy"


INTEL’S LATEST VERSION OF ONEAPI TAKES ADVANTAGE OF NEW INTEL XEON IMPROVEMENTS,
SUPPORTS AMD AND NVIDIA

by Steven Leibson - May 15, 2023

In its quest to make oneAPI a viable alternative to Nvidia’s CUDA for
parallel-processing software development, Intel has released the 2023.1 version
of its oneAPI tools. Last August in EEJournal, I wrote:

“Nvidia has something that Intel and AMD covet. No, it’s not GPUs. Intel and AMD
both make GPUs. However, they don’t have Nvidia’s not-so-secret weapon that’s a
… Read More → "Intel’s latest version of oneAPI takes advantage of new Intel
Xeon improvements, supports AMD and Nvidia"


INTELLIGENT MODULARITY AND A HOLISTIC APPROACH FOR RUGGED SYSTEM DEVELOPMENT

by Amelia Dalton - May 12, 2023

What do intelligent modularity, parametric design for reuse and reconfiguration
in rugged system development, and robots inspired by jellyfish have in common?
This week’s Fish Fry podcast! Bill Pilaud (LCR Embedded Systems) and I discuss
how intelligent modularity can make chassis design more efficient, how
parametric design can enable reuse and reconfiguration in rugged system
development, and how these approaches reflect a holistic approach for military …
Read More → "Intelligent Modularity and a Holistic Approach for Rugged System
Development"


JOIN THE INNOVATION REVOLUTION WITH NEXTFLEX AND MANUFACTURING USA!

by Max Maxfield - May 11, 2023

I have to say that I’m flabbergasted. In fact, I don’t think it would be unfair
to say that rarely has my flabber been quite so gasted. The reason for my
current state of high-gast is that I just received some frabjous intelligence
with respect to enhancing our manufacturing capabilities here in the USA.

One of the things … Read More → "Join the Innovation Revolution with NextFlex
and Manufacturing USA!"


FLEX LOGIX CONFIGURABLE HARDWARE IP FOR AI AND DSP WORKLOADS FUSES FPGAS, TENSOR
UNITS, AND SOFTWARE

by Steven Leibson - May 10, 2023

Today, we’re going to talk about AI, DSP, FPGAs, IP, and SoCs. Normally, these
things don’t all go together. Certainly, FPGAs have been used to implement AI
and DSP algorithms, although AI and DSP algorithms generally involve different
sorts of computations. (See “A Brief History of the Single-Chip DSP, Part II .”)
DSP … Read More → "Flex Logix configurable hardware IP for AI and DSP workloads
fuses FPGAs, tensor units, and software"


XMEMS LABS AIMS TO REPLACE EARBUD AND HEARING AID AUDIO DRIVERS WITH
SEMICONDUCTOR SPEAKERS

by Steven Leibson - May 8, 2023

The semiconductor story is the story of constant replacement. Early transistors
increasingly replaced vacuum tubes. Integrated circuits (ICs) replaced
transistors. Our large-screen, flat-panel displays and televisions, which
replaced cathode ray tubes, are giant-sized, thin-film semiconductors.
Semiconductor-based solid-state drives are currently replacing rotating
hard-disk storage in computers and servers. Even dynamic and electret
microphones have started to yield to tiny arrays of semiconductor MEMS
(Micro-ElectroMechanical Systems) transducers. You’ … Read More → "xMEMS Labs
Aims to Replace Earbud and Hearing Aid Audio Drivers with Semiconductor
Speakers"

Articles Archive →
industry news
May 17, 2023
The Open Group Future Airborne Capability Environment™ (FACE) Consortium
Releases Conformance Contributions to Airworthiness
New OnLogic Edge Server Empowers Businesses to Cut Costs, Make Faster Decisions
and Enhance Security
SEGGER adds 64-bit support to Embedded Studio for Arm cores
Latest products from TE Connectivity now available from Newark
New Long-Reaching USB 3.2 Compatible Reclocker/Redriver Devices for Automotive
and Industrial Applications
GlobalFoundries, Samsung Electronics, and TSMC Join Imec’s “Sustainable
Semiconductor Technologies & Systems” (SSTS) Program
Synopsys and ReversingLabs Sign Agreement to Enhance Software Supply Chain Risk
Management
IAR updates model-based design solution to master complex designs through
visualization
May 16, 2023
VIAVI Introduces T/Rx Electromagnetic Spectrum Solution
STMicroelectronics introduces its second generation of Industry 4.0-ready Edge
AI powered microprocessors
PLS’ UDE SimplyTrace eases software testing and debugging
Infineon to lead European research project on Industry 5.0 for more
sustainability and resilience in European manufacturing
May 15, 2023
CEVA Acquires Spatial Audio Business from VisiSonics to Expand its Application
Software Portfolio for Embedded Systems targeting Hearables and other Consumer
IoT Markets
Rohde & Schwarz Interactivity Test solution enables new ITU network performance
evaluation recommendation
Pasternack Announces New Test and Measurement Antennas Covering Frequencies from
2.6 to 12.4 GHz
SEMI FlexTech Invites Proposals for Flexible Hybrid Electronics Innovations
May 12, 2023
New OptiMOS™ 7 40V MOSFET family for automotive applications improves on-state
resistance, switching efficiency as well as design robustness
Arteris Selected by BOS Semiconductors for Next-Generation Automotive Chips
Infineon introduces the next generation of dual-channel isolated gate driver
ICs, pushing the performance envelope of SMPS designs
Advantech Introduces MIC-770 V3 Industrial Edge Solution with NVIDIA L4 GPU for
Industrial AI Applications
VIAVI Unveils the Rugged, Handheld CX100 ComXpert for Field Testing Tactical and
Land Mobile Radios and Networks
New eBook from Mouser Electronics and Texas Instruments Offers Guide to Navigate
the Future of Urban Air Mobility
Eaton unveils G3 Universal Input Rack PDU to meet the most diverse data center
rack power needs
Pasternack Debuts Line of Voltage-Controlled Analog Attenuators and TTL
Programmable Attenuators
May 11, 2023
Pre-Switch adds remote update and analysis features in Pre-Flex AI
soft-switching SoC to enable continual performance optimization
Power Integrations’ New 3300 V IGBT Module Gate Driver Reports Telemetry Data
for Observability, Predictive Maintenance and Lifetime Modeling
Power Integrations Unveils New SCALE-iFlex LT NTC IGBT/SiC Module Gate Drivers
with Temperature Readout
Zuken Enhances Wire Harness Manufacturing Process with the Release of Harness
Builder 2023 for E3.series
Innoscience and University of Bern develop multilevel topology reference demo to
address 850 VDC applications with 650V GaN fulfilling EV and industrial
requirements
Next-Generation onsemi 1200 V EliteSiC M3S Devices Enhance Efficiency of
Electric Vehicles and Energy Infrastructure Applications
Silicon Carbide E-Fuse Demonstrator Provides a Faster, More Reliable Method for
Protecting Power Electronics in Electric Vehicle Applications
May 10, 2023
Nexperia launches e-mode GAN FETs for low and high-voltage applications
Liquid Instruments Integrates ChatGPT into Moku Devices, Further Transforming
Test and Measurement for the Digital Age
Purdue receives $500,000 grant as part of new AI Institute focusing on
climate-smart agriculture and forestry
Keysight Obtains FiRa Validation for an Automated Ultra-Wideband PHY Conformance
Test Tool
New onsemi Hyperlux Image Sensor Family Leads the Way in Next-Generation ADAS to
Make Cars Safer
Eaton unveils G3 Universal Input Rack PDU to meet the most diverse data center
rack power needs
WiSig Networks, Sivers Semiconductors and Intel demonstrate 5G millimeter-wave
backhaul technology at G20 Event
May 9, 2023
Mouser Expands its Extensive Sensor Portfolio to Offer More Sensing Components
for Real-World Interaction
Infineon’s CoolSiC™ XHP™ 2 high-power modules enable energy-efficient
electrified trains to drive decarbonization
iWave Launches its Most Scalable & Adaptive AMD Versal AI Edge-Based SOM Series
The Design Automation Conference Announces the Technical Program with Prominent
Invited Speakers to Celebrate 60 Years Influencing Innovation
Newest Elma Rugged SFF AI System Powered by NVIDIA Jetson AGX Orin
System-on-Module
SEMI NBMC Invites Proposals for Wearable Sensor Innovations
May 8, 2023
Fairview Microwave Announces Launch of Waveguide Isolators and Circulators
News Archive →


FEATURED CHALK TALK

How IO-Link® is Enabling Smart Factory Digitization -- Analog Devices and Mouser
Electronics
Sponsored by Mouser Electronics and Analog Devices
Safety, flexibility and sustainability are cornerstone to today’s smart
factories. In this episode of Chalk Talk, Amelia Dalton and Shasta Thomas from
Analog Devices discuss how Analog Device’s IO-Link is helping usher in a new era
of smart factory automation. They take a closer look at the benefits that
IO-Link can bring to an industrial factory environment, the biggest issues
facing IO-Link sensor and master designs and how Analog Devices ??can help you
with your next industrial design.
Click here for more information about Analog Devices Inc. MAXREFDES145 8-Channel
IO-Link® Master
Feb 2, 2023
14,312 views



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discussion
Meet UVVM: The World’s #1 VHDL Verification Methodology
Posted on May 9 at 12:10am by espent
Hi Max, Yes, Jim is correct. VHDL is in fact used in more than 50% of all FPGA
projects, and the survey clearly shows that VHDL is also the leading HDL for
FPGA verification. I would assume that verification methodologies/libraries like
UVVM and OSVVM are contributing to the strong position ...
Meet UVVM: The World’s #1 VHDL Verification Methodology
Posted on May 8 at 1:40pm by Max Maxfield
Hi Jim -- I'm up to my armpits in alligators at the moment but all things are
possible for the future -- I'll also ask Espen if he would care to comment here
Meet UVVM: The World’s #1 VHDL Verification Methodology
Posted on May 5 at 12:10pm by JimLewis
Hi Max, It would be interesting to revisit this article using the updated
numbers from the 2022 Wilson Verification Survey (released in November). See:
https://blogs.sw.siemens.com/verificationhorizons/2022/11/21/part-6-the-2022-wilson-research-group-functional-verification-study/
There you can see that FPGA is dominated by VHDL. You can also see that the
survey has ...
Metaspectral Takes AI Processing of Hyperspectral Imaging by Storm
Posted on May 5 at 9:43am by Max Maxfield
I thought my jokes were bad LOL
Metaspectral Takes AI Processing of Hyperspectral Imaging by Storm
Posted on May 4 at 1:01pm by traneusee
Why do tomatoes and potatoes wear socks in the winter? To keep their toes warm.
Metaspectral Takes AI Processing of Hyperspectral Imaging by Storm
Posted on May 4 at 11:04am by Max Maxfield
I can't believe it -- my chum Matt Pulzer in the UK just reminded me of a
classic that will be great for the little girls next door: Question: What's
brown and sticky? Answer: A stick!
A Brief History of the MOS transistor, Part 6: Intel – The Third Time’s a Charm
Posted on Apr 26 at 1:19pm by SmithChart
NM Electronics -- now there is an excellent computer history trivia question!
Article full of interesting details ... great work!
A Brief History of the MOS transistor, Part 6: Intel – The Third Time’s a Charm
Posted on Apr 26 at 1:11pm by Steven Leibson
Microsystems International Ltd. (MIL) was a joint venture between the
manufacturing arm of Bell Canada and the Canadian government. In 1970, MIL paid
Intel $1.5 million to have Intel set up a semiconductor manufacturing line so
that it could make a second-source copy of the Intel 1103 DRAM. This deal helped
Intel in ...
A Brief History of the MOS transistor, Part 6: Intel – The Third Time’s a Charm
Posted on Apr 26 at 6:54am by traneusee
Canadian company Microsystems International second-sourced the Intel 8008.
TDK offers compact high-current chokes for automotive and industrial
applications
Posted on Apr 18 at 6:06pm by 艾米多利
Good Electrolytic Capacitor Supplier, the TDK !

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chalk talks
subscribe on YouTube
Nexperia Energy Harvesting Solutions
Sponsored by Mouser Electronics and Nexperia
Energy harvesting is a great way to ensure a sustainable future of electronics
by eliminating batteries and e-waste. In this episode of Chalk Talk, Amelia
Dalton and Rodrigo Mesquita from Nexperia explore the process of designing in
energy harvesting and why Nexperia’s inductor-less PMICs are an energy
harvesting game changer for wearable technology, sensor-based applications, and
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Click here for more information about Nexperia NEH2000BYJ Energy Harvesting PMIC
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Littelfuse Protection IC (eFuse)
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If you are working on an industrial, consumer, or telecom design, protection ICs
can offer a variety of valuable benefits including reverse current protection,
over temperature protection, short circuit protection, and a whole lot more. In
this episode of Chalk Talk, Amelia Dalton and Pete Pytlik from Littelfuse
explore the key features of protection ICs, how protection ICs compare to
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In this episode of Chalk Talk, Amelia Dalton and Shishir Malav from Microchip
explore the benefits of the PIC32CX-BZ2 and WBZ45 Multi-protocol Wireless MCU
Family and how it can make IoT design easier than ever before. They investigate
the components included in this multi-protocol wireless MCU family, the details
of the software architecture included in this solution, and how you can utilize
these MCUs in your next design.
Click here for more information about the Microchip Technology WBZ451 Curiosity
Board
May 4, 2023
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Non-Magnetic Interconnects
Sponsored by Mouser Electronics and Samtec
Magnets and magnetic fields can cause big problems in medical, scientific,
industrial, space, and quantum computing applications but using a non-magnetic
connector can help solve these issues. In this episode of Chalk Talk, Amelia
Dalton and John Riley from Samtec discuss the construction of non-magnetic
connectors and how you could use non-magnetic connectors in your next design.
Click here for more information about Samtec Q Strip™ High-Speed Mezzanine
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May 3, 2023
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High-Voltage Isolation for Robust and Reliable System Operation
Sponsored by Mouser Electronics and Texas Instruments
In this episode of Chalk Talk, Amelia Dalton and Luke Trowbridge from Texas
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explore the benefits of TI’s integrated transformer technology and how TI’s high
voltage isolations can help you streamline your design process, reduce your bill
of materials, and ensure reliable and robust system operation.
Click here for more information about Texas Instruments ISOW774x/ISOW774x-Q1
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Apr 27, 2023
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LEMBAS LTE/GNSS USB Modem from TE Connectivity
Sponsored by Mouser Electronics and TE Connectivity
In today’s growing IoT design community, there is an increasing need for a smart
connectivity system that helps both makers and enterprises get to market
quickly. In this episode of Chalk Talk, Amelia Dalton chats with Jin Kim from TE
Connectivity about TE’s LEMBAS LTE/GNSS USB Modem and how this plug-and-play
solution can help jumpstart your next IoT design. They also explore the
software, hardware, and data plan details of this solution and the design-in
questions you should keep in mind when considering using the LEMBAS LTE/GNSS USB
modem in your design.
Click here for more information about TE Connectivity LEMBAS LTE/GNSS USB Modem
Apr 20, 2023
3,590 views
Chalk Talk Archive →

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