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Search for: Search Menu * Articles * News * Fish Fry * Chalk Talks * Blogs * Categoriesexpand child menu * Category List * Media Kit Skip to content AGILE ANALOG MAKES THE ANALOG PARTS OF SOC DESIGN EASY PEASY LEMON SQUEEZY by Max Maxfield - May 16, 2023 I sometimes joke that I’d bend over backwards to be flexible and that I’d give my right arm to be ambidextrous (I didn’t say they were good jokes). Now, following a recent excursion into wibbly-wobbly analog space (where no one can hear you scream), I’m tempted to say that I’d jump through hoops to be more agile. I … Read More → "Agile Analog Makes the Analog Parts of SoC Design Easy Peasy Lemon Squeezy" INTEL’S LATEST VERSION OF ONEAPI TAKES ADVANTAGE OF NEW INTEL XEON IMPROVEMENTS, SUPPORTS AMD AND NVIDIA by Steven Leibson - May 15, 2023 In its quest to make oneAPI a viable alternative to Nvidia’s CUDA for parallel-processing software development, Intel has released the 2023.1 version of its oneAPI tools. Last August in EEJournal, I wrote: “Nvidia has something that Intel and AMD covet. No, it’s not GPUs. Intel and AMD both make GPUs. However, they don’t have Nvidia’s not-so-secret weapon that’s a … Read More → "Intel’s latest version of oneAPI takes advantage of new Intel Xeon improvements, supports AMD and Nvidia" INTELLIGENT MODULARITY AND A HOLISTIC APPROACH FOR RUGGED SYSTEM DEVELOPMENT by Amelia Dalton - May 12, 2023 What do intelligent modularity, parametric design for reuse and reconfiguration in rugged system development, and robots inspired by jellyfish have in common? This week’s Fish Fry podcast! Bill Pilaud (LCR Embedded Systems) and I discuss how intelligent modularity can make chassis design more efficient, how parametric design can enable reuse and reconfiguration in rugged system development, and how these approaches reflect a holistic approach for military … Read More → "Intelligent Modularity and a Holistic Approach for Rugged System Development" JOIN THE INNOVATION REVOLUTION WITH NEXTFLEX AND MANUFACTURING USA! by Max Maxfield - May 11, 2023 I have to say that I’m flabbergasted. In fact, I don’t think it would be unfair to say that rarely has my flabber been quite so gasted. The reason for my current state of high-gast is that I just received some frabjous intelligence with respect to enhancing our manufacturing capabilities here in the USA. One of the things … Read More → "Join the Innovation Revolution with NextFlex and Manufacturing USA!" FLEX LOGIX CONFIGURABLE HARDWARE IP FOR AI AND DSP WORKLOADS FUSES FPGAS, TENSOR UNITS, AND SOFTWARE by Steven Leibson - May 10, 2023 Today, we’re going to talk about AI, DSP, FPGAs, IP, and SoCs. Normally, these things don’t all go together. Certainly, FPGAs have been used to implement AI and DSP algorithms, although AI and DSP algorithms generally involve different sorts of computations. (See “A Brief History of the Single-Chip DSP, Part II .”) DSP … Read More → "Flex Logix configurable hardware IP for AI and DSP workloads fuses FPGAs, tensor units, and software" XMEMS LABS AIMS TO REPLACE EARBUD AND HEARING AID AUDIO DRIVERS WITH SEMICONDUCTOR SPEAKERS by Steven Leibson - May 8, 2023 The semiconductor story is the story of constant replacement. Early transistors increasingly replaced vacuum tubes. Integrated circuits (ICs) replaced transistors. Our large-screen, flat-panel displays and televisions, which replaced cathode ray tubes, are giant-sized, thin-film semiconductors. Semiconductor-based solid-state drives are currently replacing rotating hard-disk storage in computers and servers. Even dynamic and electret microphones have started to yield to tiny arrays of semiconductor MEMS (Micro-ElectroMechanical Systems) transducers. You’ … Read More → "xMEMS Labs Aims to Replace Earbud and Hearing Aid Audio Drivers with Semiconductor Speakers" Articles Archive → industry news May 17, 2023 The Open Group Future Airborne Capability Environment™ (FACE) Consortium Releases Conformance Contributions to Airworthiness New OnLogic Edge Server Empowers Businesses to Cut Costs, Make Faster Decisions and Enhance Security SEGGER adds 64-bit support to Embedded Studio for Arm cores Latest products from TE Connectivity now available from Newark New Long-Reaching USB 3.2 Compatible Reclocker/Redriver Devices for Automotive and Industrial Applications GlobalFoundries, Samsung Electronics, and TSMC Join Imec’s “Sustainable Semiconductor Technologies & Systems” (SSTS) Program Synopsys and ReversingLabs Sign Agreement to Enhance Software Supply Chain Risk Management IAR updates model-based design solution to master complex designs through visualization May 16, 2023 VIAVI Introduces T/Rx Electromagnetic Spectrum Solution STMicroelectronics introduces its second generation of Industry 4.0-ready Edge AI powered microprocessors PLS’ UDE SimplyTrace eases software testing and debugging Infineon to lead European research project on Industry 5.0 for more sustainability and resilience in European manufacturing May 15, 2023 CEVA Acquires Spatial Audio Business from VisiSonics to Expand its Application Software Portfolio for Embedded Systems targeting Hearables and other Consumer IoT Markets Rohde & Schwarz Interactivity Test solution enables new ITU network performance evaluation recommendation Pasternack Announces New Test and Measurement Antennas Covering Frequencies from 2.6 to 12.4 GHz SEMI FlexTech Invites Proposals for Flexible Hybrid Electronics Innovations May 12, 2023 New OptiMOS™ 7 40V MOSFET family for automotive applications improves on-state resistance, switching efficiency as well as design robustness Arteris Selected by BOS Semiconductors for Next-Generation Automotive Chips Infineon introduces the next generation of dual-channel isolated gate driver ICs, pushing the performance envelope of SMPS designs Advantech Introduces MIC-770 V3 Industrial Edge Solution with NVIDIA L4 GPU for Industrial AI Applications VIAVI Unveils the Rugged, Handheld CX100 ComXpert for Field Testing Tactical and Land Mobile Radios and Networks New eBook from Mouser Electronics and Texas Instruments Offers Guide to Navigate the Future of Urban Air Mobility Eaton unveils G3 Universal Input Rack PDU to meet the most diverse data center rack power needs Pasternack Debuts Line of Voltage-Controlled Analog Attenuators and TTL Programmable Attenuators May 11, 2023 Pre-Switch adds remote update and analysis features in Pre-Flex AI soft-switching SoC to enable continual performance optimization Power Integrations’ New 3300 V IGBT Module Gate Driver Reports Telemetry Data for Observability, Predictive Maintenance and Lifetime Modeling Power Integrations Unveils New SCALE-iFlex LT NTC IGBT/SiC Module Gate Drivers with Temperature Readout Zuken Enhances Wire Harness Manufacturing Process with the Release of Harness Builder 2023 for E3.series Innoscience and University of Bern develop multilevel topology reference demo to address 850 VDC applications with 650V GaN fulfilling EV and industrial requirements Next-Generation onsemi 1200 V EliteSiC M3S Devices Enhance Efficiency of Electric Vehicles and Energy Infrastructure Applications Silicon Carbide E-Fuse Demonstrator Provides a Faster, More Reliable Method for Protecting Power Electronics in Electric Vehicle Applications May 10, 2023 Nexperia launches e-mode GAN FETs for low and high-voltage applications Liquid Instruments Integrates ChatGPT into Moku Devices, Further Transforming Test and Measurement for the Digital Age Purdue receives $500,000 grant as part of new AI Institute focusing on climate-smart agriculture and forestry Keysight Obtains FiRa Validation for an Automated Ultra-Wideband PHY Conformance Test Tool New onsemi Hyperlux Image Sensor Family Leads the Way in Next-Generation ADAS to Make Cars Safer Eaton unveils G3 Universal Input Rack PDU to meet the most diverse data center rack power needs WiSig Networks, Sivers Semiconductors and Intel demonstrate 5G millimeter-wave backhaul technology at G20 Event May 9, 2023 Mouser Expands its Extensive Sensor Portfolio to Offer More Sensing Components for Real-World Interaction Infineon’s CoolSiC™ XHP™ 2 high-power modules enable energy-efficient electrified trains to drive decarbonization iWave Launches its Most Scalable & Adaptive AMD Versal AI Edge-Based SOM Series The Design Automation Conference Announces the Technical Program with Prominent Invited Speakers to Celebrate 60 Years Influencing Innovation Newest Elma Rugged SFF AI System Powered by NVIDIA Jetson AGX Orin System-on-Module SEMI NBMC Invites Proposals for Wearable Sensor Innovations May 8, 2023 Fairview Microwave Announces Launch of Waveguide Isolators and Circulators News Archive → FEATURED CHALK TALK How IO-Link® is Enabling Smart Factory Digitization -- Analog Devices and Mouser Electronics Sponsored by Mouser Electronics and Analog Devices Safety, flexibility and sustainability are cornerstone to today’s smart factories. In this episode of Chalk Talk, Amelia Dalton and Shasta Thomas from Analog Devices discuss how Analog Device’s IO-Link is helping usher in a new era of smart factory automation. They take a closer look at the benefits that IO-Link can bring to an industrial factory environment, the biggest issues facing IO-Link sensor and master designs and how Analog Devices ??can help you with your next industrial design. Click here for more information about Analog Devices Inc. MAXREFDES145 8-Channel IO-Link® Master Feb 2, 2023 14,312 views FEATURED VIDEO AUTOMATICALLY GENERATE, BUDGET AND OPTIMIZE UPF WITH SYNOPSYS VERDI UPF ARCHITECT Sponsored by Synopsys Learn to translate a high-level power intent from CSV to a consumable UPF across a typical ASIC design flow using Verdi UPF Architect. Power Architect can focus on the efficiency of the Power Intent instead of worrying about Syntax & UPF Semantics. Learn more about Synopsys’ Energy-Efficient SoCs Solutions discussion Meet UVVM: The World’s #1 VHDL Verification Methodology Posted on May 9 at 12:10am by espent Hi Max, Yes, Jim is correct. VHDL is in fact used in more than 50% of all FPGA projects, and the survey clearly shows that VHDL is also the leading HDL for FPGA verification. I would assume that verification methodologies/libraries like UVVM and OSVVM are contributing to the strong position ... Meet UVVM: The World’s #1 VHDL Verification Methodology Posted on May 8 at 1:40pm by Max Maxfield Hi Jim -- I'm up to my armpits in alligators at the moment but all things are possible for the future -- I'll also ask Espen if he would care to comment here Meet UVVM: The World’s #1 VHDL Verification Methodology Posted on May 5 at 12:10pm by JimLewis Hi Max, It would be interesting to revisit this article using the updated numbers from the 2022 Wilson Verification Survey (released in November). See: https://blogs.sw.siemens.com/verificationhorizons/2022/11/21/part-6-the-2022-wilson-research-group-functional-verification-study/ There you can see that FPGA is dominated by VHDL. You can also see that the survey has ... Metaspectral Takes AI Processing of Hyperspectral Imaging by Storm Posted on May 5 at 9:43am by Max Maxfield I thought my jokes were bad LOL Metaspectral Takes AI Processing of Hyperspectral Imaging by Storm Posted on May 4 at 1:01pm by traneusee Why do tomatoes and potatoes wear socks in the winter? To keep their toes warm. Metaspectral Takes AI Processing of Hyperspectral Imaging by Storm Posted on May 4 at 11:04am by Max Maxfield I can't believe it -- my chum Matt Pulzer in the UK just reminded me of a classic that will be great for the little girls next door: Question: What's brown and sticky? Answer: A stick! A Brief History of the MOS transistor, Part 6: Intel – The Third Time’s a Charm Posted on Apr 26 at 1:19pm by SmithChart NM Electronics -- now there is an excellent computer history trivia question! Article full of interesting details ... great work! A Brief History of the MOS transistor, Part 6: Intel – The Third Time’s a Charm Posted on Apr 26 at 1:11pm by Steven Leibson Microsystems International Ltd. (MIL) was a joint venture between the manufacturing arm of Bell Canada and the Canadian government. In 1970, MIL paid Intel $1.5 million to have Intel set up a semiconductor manufacturing line so that it could make a second-source copy of the Intel 1103 DRAM. This deal helped Intel in ... A Brief History of the MOS transistor, Part 6: Intel – The Third Time’s a Charm Posted on Apr 26 at 6:54am by traneusee Canadian company Microsystems International second-sourced the Intel 8008. TDK offers compact high-current chokes for automotive and industrial applications Posted on Apr 18 at 6:06pm by 艾米多利 Good Electrolytic Capacitor Supplier, the TDK ! * * * * * featured blogs Investing in Innovation — Student Design Teams May 17, 2023 Student teams working together to tackle technical challenges and find innovative solutions are the future of the electronics industry. That's why the Cadence Academic Network is committed to providing the tools and training needed to accelerate these teams to the finish line... More from Cadence... How Cloud IC Verification Reduced DRC Runtimes by 65% May 16, 2023 Chip designers are rapidly migrating to EDA tools in the cloud; learn why and explore trends in chip design tools from our panel at SNUG Silicon Valley 2023. The post How Cloud IC Verification Reduced DRC Runtimes by 65% appeared first on New Horizons for Chip Design.... More from Synopsys... Traveling to Turkey? May 8, 2023 If you are planning on traveling to Turkey in the not-so-distant future, then I have a favor to ask.... More from Max's Cool Beans... chalk talks subscribe on YouTube Nexperia Energy Harvesting Solutions Sponsored by Mouser Electronics and Nexperia Energy harvesting is a great way to ensure a sustainable future of electronics by eliminating batteries and e-waste. In this episode of Chalk Talk, Amelia Dalton and Rodrigo Mesquita from Nexperia explore the process of designing in energy harvesting and why Nexperia’s inductor-less PMICs are an energy harvesting game changer for wearable technology, sensor-based applications, and more! Click here for more information about Nexperia NEH2000BYJ Energy Harvesting PMIC May 9, 2023 1,296 views Littelfuse Protection IC (eFuse) Sponsored by Mouser Electronics and Littelfuse If you are working on an industrial, consumer, or telecom design, protection ICs can offer a variety of valuable benefits including reverse current protection, over temperature protection, short circuit protection, and a whole lot more. In this episode of Chalk Talk, Amelia Dalton and Pete Pytlik from Littelfuse explore the key features of protection ICs, how protection ICs compare to conventional discrete component solutions, and how you can take advantage of Littelfuse protection ICs in your next design. Click here for more information about Littelfuse Protection eFuse ICs May 8, 2023 1,378 views PIC32CX-BZ2 and WBZ451 Multi-Protocol Wireless MCU Family Sponsored by Mouser Electronics and Microchip In this episode of Chalk Talk, Amelia Dalton and Shishir Malav from Microchip explore the benefits of the PIC32CX-BZ2 and WBZ45 Multi-protocol Wireless MCU Family and how it can make IoT design easier than ever before. They investigate the components included in this multi-protocol wireless MCU family, the details of the software architecture included in this solution, and how you can utilize these MCUs in your next design. Click here for more information about the Microchip Technology WBZ451 Curiosity Board May 4, 2023 2,389 views Non-Magnetic Interconnects Sponsored by Mouser Electronics and Samtec Magnets and magnetic fields can cause big problems in medical, scientific, industrial, space, and quantum computing applications but using a non-magnetic connector can help solve these issues. In this episode of Chalk Talk, Amelia Dalton and John Riley from Samtec discuss the construction of non-magnetic connectors and how you could use non-magnetic connectors in your next design. Click here for more information about Samtec Q Strip™ High-Speed Mezzanine Connectors May 3, 2023 2,154 views High-Voltage Isolation for Robust and Reliable System Operation Sponsored by Mouser Electronics and Texas Instruments In this episode of Chalk Talk, Amelia Dalton and Luke Trowbridge from Texas Instruments examine the benefits of isolation in high voltage systems. They also explore the benefits of TI’s integrated transformer technology and how TI’s high voltage isolations can help you streamline your design process, reduce your bill of materials, and ensure reliable and robust system operation. Click here for more information about Texas Instruments ISOW774x/ISOW774x-Q1 Quad-Ch Digital Isolators Apr 27, 2023 2,594 views LEMBAS LTE/GNSS USB Modem from TE Connectivity Sponsored by Mouser Electronics and TE Connectivity In today’s growing IoT design community, there is an increasing need for a smart connectivity system that helps both makers and enterprises get to market quickly. In this episode of Chalk Talk, Amelia Dalton chats with Jin Kim from TE Connectivity about TE’s LEMBAS LTE/GNSS USB Modem and how this plug-and-play solution can help jumpstart your next IoT design. They also explore the software, hardware, and data plan details of this solution and the design-in questions you should keep in mind when considering using the LEMBAS LTE/GNSS USB modem in your design. Click here for more information about TE Connectivity LEMBAS LTE/GNSS USB Modem Apr 20, 2023 3,590 views Chalk Talk Archive → All material on this site copyright © 2003 - 2023 techfocus media, inc. 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