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ACCELERATING PRODUCT TIME-TO-MARKET WITH BETTER TECHNICAL COMPUTING
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Accelerating Product Time-to-Market with Better Technical Computing
By, Dan McNamara, Senior Vice President and General Manager, Server
August 28, 2023
--------------------------------------------------------------------------------
The challenges facing product design organizations to remain competitive and
increase productivity continue to intensify. As a result, more IT and
engineering leaders are relying on workload specific compute to ensure that they
are optimized for the specific workloads and design applications they are trying
to solve.
For organizations that design and build physical products, engineering
simulation and the ability to have more agile design cycles is critical. To
address this need, AMD has announced the latest addition to the EPYC™ 9004
processor series, 4th Gen AMD EPYC processors with AMD 3D V-Cache™ Technology.
Formerly codenamed “Genoa-X,” this new powerhouse processor is designed
specifically for technical computing workloads. The specs for the processor
speak for themselves: up to 96 “Zen 4” cores and more than 1GB L3 cache.
However, what it enables engineering and design teams to do is the real story.
CUSTOMER SUCCESS WITH 4TH GEN AMD EPYC PROCESSORS
Organizations can now solve some of the most compute intensive challenges faster
than ever. For example, top of stack 4th Gen AMD EPYC processors with 3D V-Cache
Technology can deliver up to 2.6x design jobs per day across top CFD workloads
versus top of stack Intel Xeon CPUs.1 For companies with advanced digital design
needs this can result in more design iterations per day and faster time to
results, allowing teams to develop better quality products with a faster time to
market – improving their competitive advantage.
To illustrate this, Nidhi Chappell of Microsoft joined me on stage to announce
the general availability of Azure HBv4 and HX-series VMs, powered by these new
processors. Compared to 3rd Gen AMD EPYC processors, MSFT expects customers to
see up to:
* 2.4x higher performance for weather simulation
* 2.7x higher performance for CFD
* 5.7x higher performance for structural analysis
According to Microsoft, STMicro, a leading semiconductor company, is already
using Azure HBv4 to reduce simulation times – allowing them to explore more
designs and expand validation for improved product quality.
Video Url
INFRASTRUCTURE CONSOLIDATION AND COST SAVINGS
These latest processors provide stellar performance while allowing organizations
to optimize data center efficiency as well. In an environment where every dollar
and square foot counts – companies can deliver the results they need with the
efficiency they require.
To learn more about 4th Gen AMD EPYC processors with 3D V-Cache Technology and
other exciting AMD data center and AI announcements and innovations, watch the
Data Center & AI premiere keynote.
DOCUMENTATION
Find the technical resources you need.
Visit Library
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Footnotes
1. https://www.amd.com/system/files/documents/amd-epyc-9004x-pb-ansys-cfx.pdf
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