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APPLICATION NOTE




APPLICATION NOTE: EVERYTHING YOU NEED TO KNOW ABOUT WIRE BONDING

Source: Knowles Precision Devices DLI

Today, one of the most cost-effective and flexible electrical interconnection
techniques available is wire bonding. With this technique, thin wire and a
combination of heat, pressure, and/or ultrasonic energy are used to create a
connection between an integrated circuit or other semiconductor devices and
device packaging.

Even though wire bonding is quite common today, the wire bonding process
requires a thorough understanding of the metallurgy, thermodynamics, and surface
chemistry involved. To ensure our customers have an excellent understanding of
wire bonds and the wire bonding process, our experts created this new app note
to cover all the details on wire bonding and how to perform the wire bonding
process. In this app note, we cover the following:

 * The two basic forms of wire bonding
 * The criteria to use for wire bond evaluation based on MIL-STD-883
 * Typical failure mechanisms for a wire bond as well as related failure
   mechanisms
 * A characterization of the differences between a supplier who uses normal wire
   bonding quality versus one who uses superior bonding quality
 * Inspection, evaluation, and testing techniques for wire bonding
 * The steps involved in ball bonding
 * Wire bonding tool and wire material information and considerations
 * How to perform additional process information for more advanced wire boding
   applications

With the details available in this app note, you will be well-prepared to create
superior-quality wire bonds for products such as our line of single layer
capacitors that will not fall victim to one of the common failure mechanisms
covered.



For full access to this content, click below.

Access Content
Application Note: Everything You Need to Know About Wire Bonding


KNOWLES PRECISION DEVICES DLI

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