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Home Products Broadcom AFEM8231 – 4G-5G MBHB LPAD

Technology, Process and Cost


BROADCOM AFEM8231 – 4G-5G MBHB LPAD

By Yole SystemPlus — Mar 2023




A COMPLETE INVESTIGATION OF THE LATEST 4G-5G MID-BAND/HIGH-BAND LPAD FROM
BROADCOM INCLUDED IN THE APPLE IPHONE 14 SERIES

SPR23731

Overview Table of content Description Companies cited

Key Features

 * Detailed photos
 * Precise measurements
 * Materials analysis
 * Manufacturing process flow
 * Supply chain evaluation
 * Manufacturing cost analysis
 * Estimated selling price
 * Technical and cost comparison with MB/HB L-PAMiD devices from Broadcom since
   2017

What's new

 * Broadcom innovation and technology reduces the component’s footprint and
   increases its performance
 * Beyond dual side molding BGA, the innovation in the packaging is the use of
   integrated passive devices for LNA circuit decoupling or PA output matching

Staying true to its choices for each previous iPhone series iteration, Apple has
again selected an innovative radio frequency (RF) front-end module (FEM) for its
flagship. Each year Broadcom, its faithful supplier, has advanced its filters
and innovative packaging technology to compete with other market players and
retain its contract. This year, for the fourth time, Broadcom chose dual side
molding ball grid array (BGA) packaging, coupled to new electromagnetic
interference (EMI) shielding to enable a very high density system-in-package
(SiP) with frequency band sharing. The packaging includes integrated passive
device (IPD) components on both sides of the printed circuit board (PCB)
substrate, and the filter design integrates single 2-in-1 or duplexer type
filters in the bulk acoustic wave (BAW) filter.

Broadcom remains the only supplier of the same module for several versions of
the latest Apple iPhone series 14 and 14 Pro Max. Like its predecessor, the
AFEM-8214, the AFEM-8231 is a mid- and high-band (MB and HB) long-term evolution
(LTE) and 5G low-noise power amplifier integrated duplexer (LPAD). It features
several dies: a power amplifier (PA), a silicon-on-insulator (SOI) switch,
silicon capacitors, IPDs and film bulk acoustic resonator (FBAR) filters. The
filters still use Avago’s Microcap bonded wafer chip-scale packaging (CSP)
technology, with through-silicon vias (TSVs) enabling electrical contacts and
scandium doped aluminum nitride (AlScN) as a piezoelectric material.

For this new version, Broadcom innovates on several points. Thanks to the dual
side molding BGA technology, the density of the packaging has grown. The
critical dies, the master switches, power management integrated circuit (PMIC),
low-noise amplifier (LNA), and decoupling capacitor, have been completely
isolated from the filtering part. To enhance the yield and reduce the cost,
Broadcom chose a silicon capacitor from a third-party company to replace the
Surface Mount Device (SMD) component. On the EMI management, compartmental
shielding using gold/silver wire bonding has hugely reduced the packaging cost.
To go further in reducing the packaging size, the IPD die has been used in the
output matching path of the PA to reduce the footprint of the inductance on the
PCB substrate. Finally, with the latest filtering design, some FBAR-BAW filters
integrated in the module are single die two-in-one filters on the transmit (Tx),
receive (Rx), and even in the receive/transmit (RxTx) path. Thanks to all these
innovations, Broadcom managed to deliver a miniaturized package despite the
added complexity of 5G.

This report contains a complete analysis of the FEM SiP, including a detailed
analysis of the PA, the switches, the LNA, the IPDs, the filtering dies, and the
internal/external EMI shielding. This report also features a cost analysis and a
price estimation of the component. Finally, it includes a comparison with the
AFEM8072, in the Apple iPhone X, the AFEM8092, in the Apple iPhone XS, the
AFEM8100, in the Apple 11 series, the AFEM8200, in the Apple 12 series and the
AFEM8214 in the Apple 13 series.









Overview  

 * Executive Summary
 * Product Specification
 * Reverse Costing Methodology
 * Glossary

Company Profile  

 * Broadcom

Physical Analysis 

 * Summary of the physical analysis
 * Packaging
 * Active Dies
 * Passive Dies

Physical Comparison 

Manufacturing Process Flow Analysis 

 * Global Overview
 * Dies Front-End Process
 * Dies Front-End Wafer Fabrication Unit
 * Packaging process

Cost Analysis 

 * Cost Summary
 * Yields Explanation & Hypotheses
 * Dies Front-End Wafer Cost
 * Dies Cost
 * Packaging Cost
 * Component Cost

Cost Comparison 

Selling Price  

 * Definitions of Price
 * Manufacturer Financials
 * Estimated Selling Price

Feedbacks 

Related Products 

About Yole Group 

 * Broadcom
 * Avago
 * Win Semiconductor
 * Global Foundries
 * Sony
 * United Microelectronics Corporation
 * Google
 * Apple
 * Samsung
 * Skyworks
 * Qorvo

7 990 €
Add to cart
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