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SEMICONDUCTOR



SYSTEMS


Designing and manufacturing the systems used to fabricate semiconductor chips

 




ENABLING THE AI ERA

The Internet of Things, Big Data and artificial intelligence (AI) demand
rapid, dramatic improvements in chip power efficiency, performance, area, cost,
and time to market (PPACt™). This challenge is the force behind our industry’s
new playbook; to meet these demands the entire industry is beginning to
collaborate in a new way. We are choosing parallel innovation over serial
innovation and promoting greater collaboration across the ecosystem—from
Materials to Systems™ and from Systems to Materials™—to accelerate the delivery
of improved chips for the AI era.



PPACT INNOVATIONS

Applied Materials is committed to accelerating the new PPACt playbook for our
customers and partners. We have the broadest and deepest portfolio of products
for delivering PPACt innovations to the market. This portfolio encompasses the
ability to create and deposit, shape and remove, modify, analyze, and connect
materials and devices in new ways. We are unique in having a broad suite of
process technology and metrology capabilities under one roof, and we have highly
differentiated silicon and packaging lab capabilities. Our Integrated Materials
Solution® technologies co-optimize materials deposition, removal, modification,
and analysis to create new materials and engineer new structures for
high-performance, low-power chips at leading-edge nodes.




NET ZERO ACCELERATION

Our systems are designed to last, to support upgrades and repurposing for new
applications, and to be easily repairable if parts fail or performance falls
below acceptable standards. All newly manufactured parts are engineered for
greater repairability, and we use refurbished parts whenever possible for repair
and remanufacture, contributing to sustainability and cost-effectiveness. We
recognize that our unique leadership position comes with tremendous
responsibility to our employees, customer and society, which is why our systems
are built green from the start as we all march towards our net zero initiatives
and Make Possible a Better Future.

Collaboration is Key to Enabling Advanced Patterning in the Angstrom Era

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Applied Materials Expands Patterning Solutions Portfolio for Angstrom Era
Chipmaking

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Advanced Patterning in the Angstrom Era: Challenges and Opportunities

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