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SALES@SOCKETS-CONNECTORS.COM

+421 918 827 231

   
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 * SOCKETS-CONNECTORS
   
   
   WIDE RANGE SOCKETS FOR EMMC SEMICONDUCTORS IN BGA PACKAGE


 * SOCKETS-CONNECTORS
   
   
   IC TEST & BURN-IN SOCKETS FOR BGA PGA QFP QFN SOP SOIC TSOP PACKAGES


 * SOCKETS-CONNECTORS
   
   
   PCB DESIGN FOR YOUR PROJECTS


WHAT DO WE HAVE TO OFFER ?


WHAT DO WE HAVE TO OFFER ?


QUICK RESPONSE TIME

Our team is ready and will respond on your inquiries on test socket in less than
24 hours, but in most cases within the same work day.


COMPETITIVE PRICING

We can provide you with very competetive pricing even on the small quantities of
test sockets, so don't hesitate and contact us now


COMPREHENSIVE SELECTION

We can recommend suitable socket from our comprehensive range of test sockets /
burn-in sockets produced by hi-quality manufacturers with operating temperature
range as low as -50°C up to max 170°C


TAILOR MADE SOLUTIONS

Apart standard solution for test sockets we also offer custom designed - tailor
made test sockets for testing and programming huge range of semiconductors. Send
us device specification and we can pick right solution for you.

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WHAT ARE TEST & BURN-IN SOCKET ?

Burn-in is one of testing processes designed to detect failures in
semiconductors and reduce potential for defects in the final application. During
burn-in, component will undergo extreme operating conditions, including high
temperature, voltage and using cycles.

Test & burn-in socket provides semi-permanent connection between device and PCB
and exposes a component at a high temperature for a specified time in an attempt
to stress all elements of the device at maximum rated operating conditions in
order to reveal all stress and time dependent failure modes.

Test & burn-in sockets are typically made with high temperature plastics,
conductive metal contacts, and various springs and hardware. We can divide test
& burn-in sockets into two main categories: clam-shell and open-top.

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Clam-shell socket consist of two parts, a lid and a body. Device under test is
placed in the body of socket and when lid is closed, it delivers force to the
testing component to actuate the burn-in socket contacts. Clam-shell sockets are
usually operated manually and require lower press force to operate.

IC test socket - open top type
IC test socket - clam shell type

Open-top burn-in sockets operates in different way. Testing component can be
seen from the top (unlike clam-shell type, where testing components is covered
by lid during testing), to load socket with component, sockets need to be
pressed down to load - and keep pressed down during entire loading process, when
released, socket pins will deliver press force to the testing component and
actuate burn-in socket contacts. Advantage of open-top burn-in sockets is, it
can be operated by robotic handlers, but usually require higher pressing force
compare to clam-shell type.

We are cooperating with all major socket manufacturers and custom socket
manufacturers - that allows us to cover all requirements from our customers.

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POPULAR IC TEST & BURN-IN SOCKETS

 * OTS-20-1.27-01
   
   
   OTS-20-1.27-01
   
    * supports SOIC packages
    * 1.27mm pitch
    * 20 pins
    * open-top very durable burn-in socket
   
   very durable burn-in socket with support 10000+ insertions, designed for SOP
   and SOIC packages with 20pins and package size 5.40mm width and max 13.10mm
   length.

 * OTS-24-0.65-01
   
   
   OTS-24-0.65-01
   
    * supports TSSOP packages
    * 0.65mm pitch
    * 24 pins
    * open-top very durable burn-in socket
   
   designed for SSOP and TSSOP packages with 24pins and package size 6.40x4.40mm

 * OTQ-144-0.65-02
   
   
   OTQ-144-0.65-02
   
    * supports QFP packages
    * 0.65mm pitch
    * 144 pins
    * open-top very durable burn-in socket
   
   OTQ-144-0.65-02 actuation force is 5,0kg.

 * OTS-28-0.65-01
   
   
   OTS-28-0.65-01
   
    * supports TSSOP packages
    * 0.65mm pitch
    * 28 pins
    * open-top very durable burn-in socket
   
   This sockets supports among many others also TI MSP430i20*, TI PGA450TPWRQ1,
   TI MSP430F122, TI MSP430F123, Nuvoton N79E715A, Nuvoton N76E885A, NXP
   PCF7945FTT/L1AC1900, NXP PCF7953ATT/M1AC1500, NXP LPC1114FDH28, NXP
   LPC1112FDH28, NXP P89LPC9*, Renesas IDT5V49EE90*

 * SB0153F-SA
   
   
   SB0153F-SA
   
    * supports BGA packages
    * 0.5mm pitch
    * 153 pins
    * open-top very durable burn-in socket
   
   SB0153F-SA, an open-top eMMC test socket designed for reliable and enduring
   semiconductor testing.
   This through-hole type socket is crafted for 153 eMMC packages, featuring a
   durable build that exceeds 10,000 testing cycles. Ideal for repeated use, the
   open-top design facilitates seamless device insertion and removal during
   testing processes. Trust in the durability and longevity of SB0153F-SA,
   ensuring consistent performance for your semiconductor testing needs.

 * SB4153AFM-ZGZB-RA
   
   
   SB4153AFM-ZGZB-RA
   
    * supports BGA packages
    * 0.5mm pitch
    * 153 pins
    * open-top very durable burn-in socket
   
   This socket is specially designed for standard 11.00x10.00 eMMC 153 ball
   devices

 * 790-41044-101G
   
   
   790-41044-101G
   
    * supports QFN packages
    * 0.5mm pitch
    * 44 pins
    * open-top very durable burn-in socket
   
   designed for QFN44 packages size 7.00x7.00 mm with 0.5mm pitch.
   Highly durable socket with 10000 guaranteed cycles.

 * 777E1048H205
   
   
   777E1048H205
   
    * supports BGA packages
    * 0.8mm pitch
    * 48 pins
    * open-top very durable burn-in socket
   
   burn-in test socket designed for BGA 48-ball packages size 11.00x9.00mm
   Very durable socket with 10000 guaranteed cycles.

 * 775C4356-XXX
   
   
   775C4356-XXX
   
    * supports BGA packages
    * 0.5mm pitch
    * 356 pins
    * open-top very durable burn-in socket
   
   This socket is designed for 15x15mm 356-ball devices with 0.30mm ball
   diameter and 0.21mm ball height

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WIDE RANGE OF SUPPORTED PACKAGES

eMMC NAND are very popular packages and we offer burn-in sockets for testing
eMMC NAND BGA devices with various pin numbers in both - clam-shell and open top
design.
Send us your inquiry on eMMC NAND socket to get quote, or provide package
specification and we will specify suitable eMMC NAND socket for you.

Request a quote

PCB DESIGN FOR YOUR PROJECT

Our engineers are ready to design PCB for your project, from creating schematic
to creating PCB layout, stack up and provide you with final data for production
and suggest best production service for you.
We can also update your existing design and optimize for easier and cost
effective assembly.

Request a quote



> Empowering Your Testing Success with Quality Sockets

sockets-connectors.com goal is to provide best service for small and big
customers worldwide. We can get required solution based on your inquiry or
select right solution by reviewing provided device drawings. We respond quick to
inquiries and ship worldwide.

TEST SOCKETS

 * * 3M/Textool
   * Aries
   * Autmwell
   * Enplas
   * KZT / ANDK
   * JC Electronics
   * Loranger

 * * MCS
   * Okins
   * Plastronics
   * QMS
   * Sensata
   * Yamaichi

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CONTACT US

Email: sales@sockets-connectors.com
Phone: +421 918 827 231
via Contact form

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+421 918 827 231

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