techfocusmedia.net
Open in
urlscan Pro
68.168.102.15
Public Scan
Submitted URL: http://techfocusmedia.net/
Effective URL: https://techfocusmedia.net/
Submission: On May 31 via manual from DE — Scanned from DE
Effective URL: https://techfocusmedia.net/
Submission: On May 31 via manual from DE — Scanned from DE
Form analysis
2 forms found in the DOMGET https://www.eejournal.com
<form role="search" method="get" class="search-form" action="https://www.eejournal.com">
<label>
<span class="screen-reader-text">Search for:</span>
<input type="search" class="search-field" placeholder="Search …" value="" name="s">
</label>
<button type="submit" class="search-submit"><span class="screen-reader-text">Search</span></button>
</form>
POST https://techfocus.activehosted.com/proc.php
<form method="POST" action="https://techfocus.activehosted.com/proc.php" id="_form_6476F899E1C24_" class="_form _form_1000 _inline-form _dark" novalidate="">
<input type="hidden" name="u" value="6476F899E1C24" data-name="u">
<input type="hidden" name="f" value="1000" data-name="f">
<input type="hidden" name="s" data-name="s">
<input type="hidden" name="c" value="0" data-name="c">
<input type="hidden" name="m" value="0" data-name="m">
<input type="hidden" name="act" value="sub" data-name="act">
<input type="hidden" name="v" value="2" data-name="v">
<input type="hidden" name="or" value="e2f07470297a943dedfa5fb28c601f38" data-name="or">
<div class="_form-content">
<div class="_form_element _x95353959 _full_width ">
<label for="email" class="_form-label">Email*</label>
<div class="_field-wrapper">
<input type="text" id="email" name="email" placeholder="" required="" data-name="email">
</div>
</div>
<div class="_form_element _x95484604 _full_width ">
<label for="firstname" class="_form-label">First Name</label>
<div class="_field-wrapper">
<input type="text" id="firstname" name="firstname" placeholder="Type your first name" data-name="firstname">
</div>
</div>
<div class="_form_element _x88705123 _full_width ">
<label for="lastname" class="_form-label">Last Name</label>
<div class="_field-wrapper">
<input type="text" id="lastname" name="lastname" placeholder="Type your last name" data-name="lastname">
</div>
</div>
<div class="_form_element _x23199688 _full_width ">
<label for="ls" class="_form-label">Enter the following to confirm your subscription*</label>
<div class="g-recaptcha" data-sitekey="6LcwIw8TAAAAACP1ysM08EhCgzd6q5JAOUR1a0Go" id="recaptcha_0">
<div style="width: 304px; height: 78px;">
<div><iframe title="reCAPTCHA"
src="https://www.google.com/recaptcha/api2/anchor?ar=1&k=6LcwIw8TAAAAACP1ysM08EhCgzd6q5JAOUR1a0Go&co=aHR0cHM6Ly90ZWNoZm9jdXNtZWRpYS5uZXQ6NDQz&hl=de&v=CDFvp7CXAHw7k3HxO47Gm1O9&size=normal&cb=x1y8w3nalil8"
width="304" height="78" role="presentation" name="a-1la8uiiu046s" frameborder="0" scrolling="no"
sandbox="allow-forms allow-popups allow-same-origin allow-scripts allow-top-navigation allow-modals allow-popups-to-escape-sandbox"></iframe></div><textarea id="g-recaptcha-response" name="g-recaptcha-response"
class="g-recaptcha-response" style="width: 250px; height: 40px; border: 1px solid rgb(193, 193, 193); margin: 10px 25px; padding: 0px; resize: none; display: none;"></textarea>
</div><iframe style="display: none;"></iframe>
</div>
</div>
<div class="_button-wrapper _full_width"><button id="_form_1000_submit" class="_submit" type="submit">Subscribe</button></div>
<div class="_clear-element"></div>
</div>
<div class="_form-thank-you" style="display:none;"></div>
<input type="hidden" name="pum_form_popup_id" value="74267">
</form>
Text Content
Search for: Search Menu * Articles * News * Fish Fry * Chalk Talks * Blogs * Categoriesexpand child menu * Category List * Media Kit Skip to content GRUESOME GAMBOLS GRIPPING GENERATIVE AI (PART 1) by Max Maxfield - May 30, 2023 I love being me, which is a good thing when you come to think about it, because I don’t think the alternative would be much fun. In addition to being a trend-setter and leader of fashion, one of the things I’ve been blessed with is a good imagination, but—as we will see—a good imagination can be a double-edged sword. … Read More → "Gruesome Gambols Gripping Generative AI (Part 1)" THE SEMICONDUCTOR COMPANY FROM ANOTHER WORLD: THE SILICONIX STORY, PART 2 – STARTING THE OPTICAL ENCODER INDUSTRY by Steven Leibson - May 29, 2023 Bill Hugle and Frances Sarnat married in 1947 after each had earned an undergraduate degree in chemistry at the University of Chicago. The two started a business making artificial gemstones in 1948, but the venture went bust by 1951 because of a patent infringement lawsuit brought against Bill Hugle by Linde Air Products, which had hired him as a plant chemist in 1947, just before he started his side business with … Read More → "The Semiconductor Company from Another World: The Siliconix Story, Part 2 – Starting the Optical Encoder Industry" THE NETWORK-ON-CHIP PIONEER: HOW ARTERIS ENABLING SOC DEVELOPERS TO CREATE PHYSICALLY VALID NOCS FASTER by Amelia Dalton - May 26, 2023 Physically aware network-on-chips take center stage in this week’s Fish Fry podcast! Andy Nightingale from Arteris and I investigate the role that network-on-chips have played in the development of SoC designs. We also discuss the details of Arteris’ FlexNoC 5 Physically Aware Network-on-Chip IP, and how a physically aware NoC can not only help you address your PPA goals but also get you to physical convergence faster. Also this … Read More → "The Network-on-Chip Pioneer: How Arteris Enabling SoC Developers to Create Physically Valid NoCs Faster" USING GENERATIVE AI FOR REFACTORING AND DEBUGGING CODE CUTS DEBUGGING TIME IN HALF! by Max Maxfield - May 25, 2023 I am currently wearing my patent-pending puzzled and perplexed expression. This manly mien was handed down to me by my father when he determined he had no further use for it. It was the aspect he assumed when my mother requested him to undertake some chore around the house. Oftentimes, he managed to look so befuddled and bewildered that she ended up performing the task herself. I’ … Read More → "Using Generative AI for Refactoring and Debugging Code Cuts Debugging Time in Half!" THE SEMICONDUCTOR COMPANY THAT CAME FROM ANOTHER WORLD: THE SILICONIX STORY, PART 1 – STARTING WITH STAR SAPPHIRES by Steven Leibson - May 22, 2023 Starting in the 1940s, Bill Hugle and Frances Sarnat Hugle founded technology companies that drew them further and further into the semiconductor business. Together they kicked off the development of precision optical encoders, founded semiconductor makers Siliconix and Stewart-Warner Microcircuits, and developed semiconductor manufacturing equipment on both the east and west coasts of the US. Along the way, the couple endured many business reversals and enough legal … Read More → "The Semiconductor Company That Came From Another World: the Siliconix Story, Part 1 – Starting With Star Sapphires" CALLING ALL SOFTWARE DEVELOPERS! HOW CACHEQ IS ACCELERATING CODE ACROSS HETEROGENEOUS COMPUTE PLATFORMS by Amelia Dalton - May 19, 2023 In this week’s Fish Fry podcast, I investigate how you can shorten your development time and accelerate code across heterogeneous compute platforms with CacheQ Systems CEO Clay Johnson. Clay and I explore the benefits of heterogeneous compute development, the details of CacheQ’s QCC development platform and what sets CacheQ’s QCC development platform apart from open-source tools. … Read More → "Calling All Software Developers! How CacheQ is Accelerating Code Across Heterogeneous Compute Platforms" Articles Archive → industry news May 30, 2023 Eric Schleicher, Founder and CEO of Constructive Realities Announced as Winner of OKdo’s Global ROCK Engineering Challenge Cadence Collaborates with Arm to Accelerate Mobile Device Silicon Success with New Arm Total Compute Solutions Vishay Intertechnology Thick Film Power Resistor With Optional NTC Thermistor and PC-TIM Simplifies Designs, Saves Board Space, and Lowers Costs Keysight and Nokia Bell Labs to Demonstrate 6G Subterahertz Component Characterization at IMS 2023 Nicomatic opens new testing laboratory, offering materials test services for customer products ipoque showcases latest advancements in DPI and GTP correlation at Cisco Live 2023 May 26, 2023 Rohde & Schwarz to host RF Design Challenge at IMS2023 Small Range Torque Sensors Allow Accurate Measurements to 0.2Nm Avnet and Fujikura Accelerate 5G mmWave Phased Array Antenna-to-Bits System Design with 5G mmWave PAAM Development Platform Keysight Unveils First Midrange Network Analyzer Delivering Fast, Accurate Error Vector Magnitude Measurements May 25, 2023 SEMI North America Advisory Board Welcomes New Members From ASML and Breker Verification Systems DFI Launches New Smart Transportation Solutions Focusing on AI Edge Computing, Information Security, and the Development of Sustainable Technology at Computex AirFuel Alliance Announces Certified Engineer Training for RF Wireless Charging Standard Circular Plastic Shell Connector from Amphenol Reduces Installation Time May 24, 2023 Molex Unveils First-to-Market, Chip-to-Chip 224G Product Portfolio to Accelerate Support for Next-Gen Data Centers & Generative AI Applications IQE announces 200mm (8”) RGB Epitaxy for MicroLED Display Qualification Mouser Electronics Offers Latest in Autonomous Vehicle Design Resources for Engineers Signal Hound’s Spike™ Software Now Supports RHEL 8 for BB and SM Series Spectrum Analyzers May 23, 2023 PCI-SIG Certifies VectorPath Accelerator Card for PCIe Gen5 x16 @ 32 GT/s New NXP S32G support from eSOL enhances eMCOS® SDK Titan Tool Supply Introduces Industrial Micro Fiberscope Series Imec first to demonstrate conductor films on 300mm wafers with lower resistivity than Cu and Ru Microchip Extends its Radiation-Tolerant Family of Gigabit Ethernet PHYs ITTIA’s Modern Edge Database Supports NXP S32G Vehicle Network Processors May 22, 2023 Fairview Microwave Launches Waveguide Power Amplifiers Covering High mm-Wave Frequency Bands JetCool Debuts Self-Contained Liquid Cooling Systems at Dell Technologies World Green, Digital Transformation: Infineon Launches EU Projects for Power Electronics and Artificial Intelligence Micron to Bring EUV Technology to Japan, Advancing Next-Generation Memory Manufacturing May 19, 2023 Efabless Announces AI Generated Open-Source Silicon Design Challenge ASRock Industrial’s Latest AIoT Solutions at COMPUTEX 2023 Offers a Glimpse into the Future of Edge Computing Mouser Offers a Wide Range of Development Kits to Speed IoT Prototyping and Deployment RIKEN and Intel to Undertake Joint Research in Next-Generation Computing New IP Rated Models Added to CUI Devices’ Waterproof Speakers Offering Infineon acquires Tiny Machine Learning leader Imagimob to strengthen its offering in embedded AI solutions TDK offers extremely compact TVS diodes for complete ESD protection of USB-C May 18, 2023 NXP and TSMC to Deliver Industry’s First Automotive 16 nm FinFET Embedded MRAM Magna-Power Introduces Pitel Paste: A High-Performance Thermal Paste for Power Electronics Applications KP Performance Antennas Rolls Out New Line of IoT Multiband Combination Antennas Saelig Introduces Compact Micsig SigOFIT Series Opto-isolated Probes The Gemns G100 EHG Wireless Panel Switch by WePower Brings Energy Harvesting to IoT Product Design and Development May 17, 2023 The Open Group Future Airborne Capability Environment™ (FACE) Consortium Releases Conformance Contributions to Airworthiness New OnLogic Edge Server Empowers Businesses to Cut Costs, Make Faster Decisions and Enhance Security SEGGER adds 64-bit support to Embedded Studio for Arm cores Latest products from TE Connectivity now available from Newark New Long-Reaching USB 3.2 Compatible Reclocker/Redriver Devices for Automotive and Industrial Applications News Archive → FEATURED CHALK TALK High-Voltage Isolation for Robust and Reliable System Operation Sponsored by Mouser Electronics and Texas Instruments In this episode of Chalk Talk, Amelia Dalton and Luke Trowbridge from Texas Instruments examine the benefits of isolation in high voltage systems. They also explore the benefits of TI’s integrated transformer technology and how TI’s high voltage isolations can help you streamline your design process, reduce your bill of materials, and ensure reliable and robust system operation. Click here for more information about Texas Instruments ISOW774x/ISOW774x-Q1 Quad-Ch Digital Isolators Apr 27, 2023 4,340 views FEATURED CONTEST JOIN THE AI GENERATED OPEN-SOURCE SILICON DESIGN CHALLENGE Sponsored by Efabless Get your AI-generated design manufactured ($9,750 value)! Enter the E-fabless open-source silicon design challenge. Use generative AI to create Verilog from natural language prompts, then implement your design using the Efabless chipIgnite platform - including an SoC template (Caravel) providing rapid chip-level integration, and an open-source RTL-to-GDS digital design flow (OpenLane). The winner gets their design manufactured by eFabless. Hurry, though - deadline is June 2! Click here to enter! FEATURED VIDEO SHIFT-LEFT WITH POWER EMULATION USING REAL WORKLOADS Sponsored by Synopsys Increasing software content and larger chips are demanding pre-silicon power for real-life workloads. Synopsys profile, analyze, and signoff emulation power steps to identify and analyze interesting stimulus from seconds of silicon runtime are discussed. Learn more about Synopsys’ Energy-Efficient SoCs Solutions discussion Meet UVVM: The World’s #1 VHDL Verification Methodology Posted on May 30 at 3:12pm by JimLewis Hi Max, > I’m up to my armpits in alligators I suppose that is better than being up to your eyeballs. :) If you have enough time to click the link you will see that in 2022, OSVVM regained the title of worlds #1 VHDL verification methodology. Cheers, Jim Meet UVVM: The World’s #1 VHDL Verification Methodology Posted on May 9 at 12:10am by espent Hi Max, Yes, Jim is correct. VHDL is in fact used in more than 50% of all FPGA projects, and the survey clearly shows that VHDL is also the leading HDL for FPGA verification. I would assume that verification methodologies/libraries like UVVM and OSVVM are contributing to the strong position ... Meet UVVM: The World’s #1 VHDL Verification Methodology Posted on May 8 at 1:40pm by Max Maxfield Hi Jim -- I'm up to my armpits in alligators at the moment but all things are possible for the future -- I'll also ask Espen if he would care to comment here Meet UVVM: The World’s #1 VHDL Verification Methodology Posted on May 5 at 12:10pm by JimLewis Hi Max, It would be interesting to revisit this article using the updated numbers from the 2022 Wilson Verification Survey (released in November). See: https://blogs.sw.siemens.com/verificationhorizons/2022/11/21/part-6-the-2022-wilson-research-group-functional-verification-study/ There you can see that FPGA is dominated by VHDL. You can also see that the survey has ... Metaspectral Takes AI Processing of Hyperspectral Imaging by Storm Posted on May 5 at 9:43am by Max Maxfield I thought my jokes were bad LOL Metaspectral Takes AI Processing of Hyperspectral Imaging by Storm Posted on May 4 at 1:01pm by traneusee Why do tomatoes and potatoes wear socks in the winter? To keep their toes warm. Metaspectral Takes AI Processing of Hyperspectral Imaging by Storm Posted on May 4 at 11:04am by Max Maxfield I can't believe it -- my chum Matt Pulzer in the UK just reminded me of a classic that will be great for the little girls next door: Question: What's brown and sticky? Answer: A stick! A Brief History of the MOS transistor, Part 6: Intel – The Third Time’s a Charm Posted on Apr 26 at 1:19pm by SmithChart NM Electronics -- now there is an excellent computer history trivia question! Article full of interesting details ... great work! A Brief History of the MOS transistor, Part 6: Intel – The Third Time’s a Charm Posted on Apr 26 at 1:11pm by Steven Leibson Microsystems International Ltd. (MIL) was a joint venture between the manufacturing arm of Bell Canada and the Canadian government. In 1970, MIL paid Intel $1.5 million to have Intel set up a semiconductor manufacturing line so that it could make a second-source copy of the Intel 1103 DRAM. This deal helped Intel in ... A Brief History of the MOS transistor, Part 6: Intel – The Third Time’s a Charm Posted on Apr 26 at 6:54am by traneusee Canadian company Microsystems International second-sourced the Intel 8008. * * * * * featured blogs DEI@Cadence: Celebrating My First Month as an Intern at Cadence Cork! May 30, 2023 Diversity, equity, and inclusion (DEI) are not just words but values that are exemplified through our culture at Cadence. In the DEI@Cadence blog series, you'll find a community where employees share their perspectives and experiences. By providing a glimpse of their personal... More from Cadence... Synopsys 2022 ESG Report: Building a Smart Future Together May 30, 2023 Explore our 2022 environmental, social, and governance (ESG) report to explore our sustainable business practices and our progress in building a smart future. The post Synopsys 2022 ESG Report: Building a Smart Future Together appeared first on New Horizons for Chip Design.... More from Synopsys... Traveling to Turkey? May 8, 2023 If you are planning on traveling to Turkey in the not-so-distant future, then I have a favor to ask.... More from Max's Cool Beans... chalk talks subscribe on YouTube Optimize Performance: RF Solutions from PCB to Antenna Sponsored by Mouser Electronics and Amphenol RF RF is a ubiquitous design element found in a large variety of electronic designs today. In this episode of Chalk Talk, Amelia Dalton and Rahul Rajan from Amphenol RF discuss how you can optimize your RF performance through each step of the signal chain. They examine how you can utilize Amphenol’s RF wide range of connectors including solutions for PCBs, board to board RF connectivity, board to panel and more! Click here for more information about products from Amphenol RF May 25, 2023 781 views High Voltage Stackable Dual Phase Constant On Time Controllers - Microchip and Mouser Sponsored by Mouser Electronics and Microchip In this episode of Chalk Talk, Chris Romano from Microchip and Amelia Dalton discuss the what, where, and how of Microchip’s high voltage stackable dual phase constant on time controllers. They investigate the stacking capabilities of the MIC2132 controller, how these controllers compare with other solutions on the market, and how you can take advantage of these solutions in your next design. Click here for more information about Microchip Technology MIC2132 Dual Phase Synchronous Buck Controllers May 22, 2023 1,159 views Achieving High Power Density with IGBT and SiC Power Modules Sponsored by Mouser Electronics and Infineon Recent trends in the inverter market have made high power density, scalability, and ease of assembly more important than ever before. In this episode of Chalk Talk, Amelia Dalton and Abraham Markose from Infineon examine how Easy & Econo power modules from Infineon can help solve common inverter design requirements. They explore the benefits and construction of these modules and how you can take advantage of them in your next design. Click here for more information about Infineon Technologies EconoDUAL™ 3 IGBT Modules May 19, 2023 1,174 views Nexperia Energy Harvesting Solutions Sponsored by Mouser Electronics and Nexperia Energy harvesting is a great way to ensure a sustainable future of electronics by eliminating batteries and e-waste. In this episode of Chalk Talk, Amelia Dalton and Rodrigo Mesquita from Nexperia explore the process of designing in energy harvesting and why Nexperia’s inductor-less PMICs are an energy harvesting game changer for wearable technology, sensor-based applications, and more! Click here for more information about Nexperia NEH2000BYJ Energy Harvesting PMIC May 9, 2023 3,059 views Littelfuse Protection IC (eFuse) Sponsored by Mouser Electronics and Littelfuse If you are working on an industrial, consumer, or telecom design, protection ICs can offer a variety of valuable benefits including reverse current protection, over temperature protection, short circuit protection, and a whole lot more. In this episode of Chalk Talk, Amelia Dalton and Pete Pytlik from Littelfuse explore the key features of protection ICs, how protection ICs compare to conventional discrete component solutions, and how you can take advantage of Littelfuse protection ICs in your next design. Click here for more information about Littelfuse Protection eFuse ICs May 8, 2023 3,076 views PIC32CX-BZ2 and WBZ451 Multi-Protocol Wireless MCU Family Sponsored by Mouser Electronics and Microchip In this episode of Chalk Talk, Amelia Dalton and Shishir Malav from Microchip explore the benefits of the PIC32CX-BZ2 and WBZ45 Multi-protocol Wireless MCU Family and how it can make IoT design easier than ever before. They investigate the components included in this multi-protocol wireless MCU family, the details of the software architecture included in this solution, and how you can utilize these MCUs in your next design. Click here for more information about the Microchip Technology WBZ451 Curiosity Board May 4, 2023 4,543 views Chalk Talk Archive → All material on this site copyright © 2003 - 2023 techfocus media, inc. All rights reserved. Privacy Policy Media Kit Contact Us Log In Subscribe to EE Journal Daily Email* First Name Last Name Enter the following to confirm your subscription* Subscribe ×