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GRUESOME GAMBOLS GRIPPING GENERATIVE AI (PART 1)

by Max Maxfield - May 30, 2023

I love being me, which is a good thing when you come to think about it, because
I don’t think the alternative would be much fun. In addition to being a
trend-setter and leader of fashion, one of the things I’ve been blessed with is
a good imagination, but—as we will see—a good imagination can be a double-edged
sword.

… Read More → "Gruesome Gambols Gripping Generative AI (Part 1)"


THE SEMICONDUCTOR COMPANY FROM ANOTHER WORLD: THE SILICONIX STORY, PART 2 –
STARTING THE OPTICAL ENCODER INDUSTRY

by Steven Leibson - May 29, 2023

Bill Hugle and Frances Sarnat married in 1947 after each had earned an
undergraduate degree in chemistry at the University of Chicago. The two started
a business making artificial gemstones in 1948, but the venture went bust by
1951 because of a patent infringement lawsuit brought against Bill Hugle by
Linde Air Products, which had hired him as a plant chemist in 1947, just before
he started his side business with … Read More → "The Semiconductor Company from
Another World: The Siliconix Story, Part 2 – Starting the Optical Encoder
Industry"


THE NETWORK-ON-CHIP PIONEER: HOW ARTERIS ENABLING SOC DEVELOPERS TO CREATE
PHYSICALLY VALID NOCS FASTER

by Amelia Dalton - May 26, 2023

Physically aware network-on-chips take center stage in this week’s Fish Fry
podcast! Andy Nightingale from Arteris and I investigate the role that
network-on-chips have played in the development of SoC designs. We also discuss
the details of Arteris’ FlexNoC 5 Physically Aware Network-on-Chip IP, and how a
physically aware NoC can not only help you address your PPA goals but also get
you to physical convergence faster. Also this … Read More → "The Network-on-Chip
Pioneer: How Arteris Enabling SoC Developers to Create Physically Valid NoCs
Faster"


USING GENERATIVE AI FOR REFACTORING AND DEBUGGING CODE CUTS DEBUGGING TIME IN
HALF!

by Max Maxfield - May 25, 2023

I am currently wearing my patent-pending puzzled and perplexed expression. This
manly mien was handed down to me by my father when he determined he had no
further use for it. It was the aspect he assumed when my mother requested him to
undertake some chore around the house. Oftentimes, he managed to look so
befuddled and bewildered that she ended up performing the task herself. I’ …
Read More → "Using Generative AI for Refactoring and Debugging Code Cuts
Debugging Time in Half!"


THE SEMICONDUCTOR COMPANY THAT CAME FROM ANOTHER WORLD: THE SILICONIX STORY,
PART 1 – STARTING WITH STAR SAPPHIRES

by Steven Leibson - May 22, 2023

Starting in the 1940s, Bill Hugle and Frances Sarnat Hugle founded technology
companies that drew them further and further into the semiconductor business.
Together they kicked off the development of precision optical encoders, founded
semiconductor makers Siliconix and Stewart-Warner Microcircuits, and developed
semiconductor manufacturing equipment on both the east and west coasts of the
US. Along the way, the couple endured many business reversals and enough legal …
Read More → "The Semiconductor Company That Came From Another World: the
Siliconix Story, Part 1 – Starting With Star Sapphires"


CALLING ALL SOFTWARE DEVELOPERS! HOW CACHEQ IS ACCELERATING CODE ACROSS
HETEROGENEOUS COMPUTE PLATFORMS

by Amelia Dalton - May 19, 2023

In this week’s Fish Fry podcast, I investigate how you can shorten your
development time and accelerate code across heterogeneous compute platforms with
CacheQ Systems CEO Clay Johnson. Clay and I explore the benefits of
heterogeneous compute development, the details of CacheQ’s QCC development
platform and what sets CacheQ’s QCC development platform apart from open-source
tools.

… Read More → "Calling All Software Developers! How CacheQ is Accelerating Code
Across Heterogeneous Compute Platforms"

Articles Archive →
industry news
May 30, 2023
Eric Schleicher, Founder and CEO of Constructive Realities Announced as Winner
of OKdo’s Global ROCK Engineering Challenge
Cadence Collaborates with Arm to Accelerate Mobile Device Silicon Success with
New Arm Total Compute Solutions
Vishay Intertechnology Thick Film Power Resistor With Optional NTC Thermistor
and PC-TIM Simplifies Designs, Saves Board Space, and Lowers Costs
Keysight and Nokia Bell Labs to Demonstrate 6G Subterahertz Component
Characterization at IMS 2023
Nicomatic opens new testing laboratory, offering materials test services for
customer products
ipoque showcases latest advancements in DPI and GTP correlation at Cisco Live
2023
May 26, 2023
Rohde & Schwarz to host RF Design Challenge at IMS2023
Small Range Torque Sensors Allow Accurate Measurements to 0.2Nm
Avnet and Fujikura Accelerate 5G mmWave Phased Array Antenna-to-Bits System
Design with 5G mmWave PAAM Development Platform
Keysight Unveils First Midrange Network Analyzer Delivering Fast, Accurate Error
Vector Magnitude Measurements
May 25, 2023
SEMI North America Advisory Board Welcomes New Members From ASML and Breker
Verification Systems
DFI Launches New Smart Transportation Solutions Focusing on AI Edge Computing,
Information Security, and the Development of Sustainable Technology at Computex
AirFuel Alliance Announces Certified Engineer Training for RF Wireless Charging
Standard
Circular Plastic Shell Connector from Amphenol Reduces Installation Time
May 24, 2023
Molex Unveils First-to-Market, Chip-to-Chip 224G Product Portfolio to Accelerate
Support for Next-Gen Data Centers & Generative AI Applications
IQE announces 200mm (8”) RGB Epitaxy for MicroLED Display Qualification
Mouser Electronics Offers Latest in Autonomous Vehicle Design Resources for
Engineers
Signal Hound’s Spike™ Software Now Supports RHEL 8 for BB and SM Series Spectrum
Analyzers
May 23, 2023
PCI-SIG Certifies VectorPath Accelerator Card for PCIe Gen5 x16 @ 32 GT/s
New NXP S32G support from eSOL enhances eMCOS® SDK
Titan Tool Supply Introduces Industrial Micro Fiberscope Series
Imec first to demonstrate conductor films on 300mm wafers with lower resistivity
than Cu and Ru
Microchip Extends its Radiation-Tolerant Family of Gigabit Ethernet PHYs
ITTIA’s Modern Edge Database Supports NXP S32G Vehicle Network Processors
May 22, 2023
Fairview Microwave Launches Waveguide Power Amplifiers Covering High mm-Wave
Frequency Bands
JetCool Debuts Self-Contained Liquid Cooling Systems at Dell Technologies World
Green, Digital Transformation: Infineon Launches EU Projects for Power
Electronics and Artificial Intelligence
Micron to Bring EUV Technology to Japan, Advancing Next-Generation Memory
Manufacturing
May 19, 2023
Efabless Announces AI Generated Open-Source Silicon Design Challenge
ASRock Industrial’s Latest AIoT Solutions at COMPUTEX 2023 Offers a Glimpse into
the Future of Edge Computing
Mouser Offers a Wide Range of Development Kits to Speed IoT Prototyping and
Deployment
RIKEN and Intel to Undertake Joint Research in Next-Generation Computing
New IP Rated Models Added to CUI Devices’ Waterproof Speakers Offering
Infineon acquires Tiny Machine Learning leader Imagimob to strengthen its
offering in embedded AI solutions
TDK offers extremely compact TVS diodes for complete ESD protection of USB-C
May 18, 2023
NXP and TSMC to Deliver Industry’s First Automotive 16 nm FinFET Embedded MRAM
Magna-Power Introduces Pitel Paste: A High-Performance Thermal Paste for Power
Electronics Applications
KP Performance Antennas Rolls Out New Line of IoT Multiband Combination Antennas
Saelig Introduces Compact Micsig SigOFIT Series Opto-isolated Probes
The Gemns G100 EHG Wireless Panel Switch by WePower Brings Energy Harvesting to
IoT Product Design and Development
May 17, 2023
The Open Group Future Airborne Capability Environment™ (FACE) Consortium
Releases Conformance Contributions to Airworthiness
New OnLogic Edge Server Empowers Businesses to Cut Costs, Make Faster Decisions
and Enhance Security
SEGGER adds 64-bit support to Embedded Studio for Arm cores
Latest products from TE Connectivity now available from Newark
New Long-Reaching USB 3.2 Compatible Reclocker/Redriver Devices for Automotive
and Industrial Applications
News Archive →


FEATURED CHALK TALK

High-Voltage Isolation for Robust and Reliable System Operation
Sponsored by Mouser Electronics and Texas Instruments
In this episode of Chalk Talk, Amelia Dalton and Luke Trowbridge from Texas
Instruments examine the benefits of isolation in high voltage systems. They also
explore the benefits of TI’s integrated transformer technology and how TI’s high
voltage isolations can help you streamline your design process, reduce your bill
of materials, and ensure reliable and robust system operation.
Click here for more information about Texas Instruments ISOW774x/ISOW774x-Q1
Quad-Ch Digital Isolators
Apr 27, 2023
4,340 views


FEATURED CONTEST


JOIN THE AI GENERATED OPEN-SOURCE SILICON DESIGN CHALLENGE

Sponsored by Efabless

Get your AI-generated design manufactured ($9,750 value)! Enter the E-fabless
open-source silicon design challenge. Use generative AI to create Verilog from
natural language prompts, then implement your design using the Efabless
chipIgnite platform - including an SoC template (Caravel) providing rapid
chip-level integration, and an open-source RTL-to-GDS digital design flow
(OpenLane). The winner gets their design manufactured by eFabless. Hurry, though
- deadline is June 2!

Click here to enter!


FEATURED VIDEO


SHIFT-LEFT WITH POWER EMULATION USING REAL WORKLOADS

Sponsored by Synopsys

Increasing software content and larger chips are demanding pre-silicon power for
real-life workloads. Synopsys profile, analyze, and signoff emulation power
steps to identify and analyze interesting stimulus from seconds of silicon
runtime are discussed.

Learn more about Synopsys’ Energy-Efficient SoCs Solutions

discussion
Meet UVVM: The World’s #1 VHDL Verification Methodology
Posted on May 30 at 3:12pm by JimLewis
Hi Max, > I’m up to my armpits in alligators I suppose that is better than being
up to your eyeballs. :) If you have enough time to click the link you will see
that in 2022, OSVVM regained the title of worlds #1 VHDL verification
methodology. Cheers, Jim
Meet UVVM: The World’s #1 VHDL Verification Methodology
Posted on May 9 at 12:10am by espent
Hi Max, Yes, Jim is correct. VHDL is in fact used in more than 50% of all FPGA
projects, and the survey clearly shows that VHDL is also the leading HDL for
FPGA verification. I would assume that verification methodologies/libraries like
UVVM and OSVVM are contributing to the strong position ...
Meet UVVM: The World’s #1 VHDL Verification Methodology
Posted on May 8 at 1:40pm by Max Maxfield
Hi Jim -- I'm up to my armpits in alligators at the moment but all things are
possible for the future -- I'll also ask Espen if he would care to comment here
Meet UVVM: The World’s #1 VHDL Verification Methodology
Posted on May 5 at 12:10pm by JimLewis
Hi Max, It would be interesting to revisit this article using the updated
numbers from the 2022 Wilson Verification Survey (released in November). See:
https://blogs.sw.siemens.com/verificationhorizons/2022/11/21/part-6-the-2022-wilson-research-group-functional-verification-study/
There you can see that FPGA is dominated by VHDL. You can also see that the
survey has ...
Metaspectral Takes AI Processing of Hyperspectral Imaging by Storm
Posted on May 5 at 9:43am by Max Maxfield
I thought my jokes were bad LOL
Metaspectral Takes AI Processing of Hyperspectral Imaging by Storm
Posted on May 4 at 1:01pm by traneusee
Why do tomatoes and potatoes wear socks in the winter? To keep their toes warm.
Metaspectral Takes AI Processing of Hyperspectral Imaging by Storm
Posted on May 4 at 11:04am by Max Maxfield
I can't believe it -- my chum Matt Pulzer in the UK just reminded me of a
classic that will be great for the little girls next door: Question: What's
brown and sticky? Answer: A stick!
A Brief History of the MOS transistor, Part 6: Intel – The Third Time’s a Charm
Posted on Apr 26 at 1:19pm by SmithChart
NM Electronics -- now there is an excellent computer history trivia question!
Article full of interesting details ... great work!
A Brief History of the MOS transistor, Part 6: Intel – The Third Time’s a Charm
Posted on Apr 26 at 1:11pm by Steven Leibson
Microsystems International Ltd. (MIL) was a joint venture between the
manufacturing arm of Bell Canada and the Canadian government. In 1970, MIL paid
Intel $1.5 million to have Intel set up a semiconductor manufacturing line so
that it could make a second-source copy of the Intel 1103 DRAM. This deal helped
Intel in ...
A Brief History of the MOS transistor, Part 6: Intel – The Third Time’s a Charm
Posted on Apr 26 at 6:54am by traneusee
Canadian company Microsystems International second-sourced the Intel 8008.

 * 
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 * 
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chalk talks
subscribe on YouTube
Optimize Performance: RF Solutions from PCB to Antenna
Sponsored by Mouser Electronics and Amphenol RF
RF is a ubiquitous design element found in a large variety of electronic designs
today. In this episode of Chalk Talk, Amelia Dalton and Rahul Rajan from
Amphenol RF discuss how you can optimize your RF performance through each step
of the signal chain. They examine how you can utilize Amphenol’s RF wide range
of connectors including solutions for PCBs, board to board RF connectivity,
board to panel and more!
Click here for more information about products from Amphenol RF
May 25, 2023
781 views
High Voltage Stackable Dual Phase Constant On Time Controllers - Microchip and
Mouser
Sponsored by Mouser Electronics and Microchip
In this episode of Chalk Talk, Chris Romano from Microchip and Amelia Dalton
discuss the what, where, and how of Microchip’s high voltage stackable dual
phase constant on time controllers. They investigate the stacking capabilities
of the MIC2132 controller, how these controllers compare with other solutions on
the market, and how you can take advantage of these solutions in your next
design.
Click here for more information about Microchip Technology MIC2132 Dual Phase
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May 22, 2023
1,159 views
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Sponsored by Mouser Electronics and Infineon
Recent trends in the inverter market have made high power density, scalability,
and ease of assembly more important than ever before. In this episode of Chalk
Talk, Amelia Dalton and Abraham Markose from Infineon examine how Easy & Econo
power modules from Infineon can help solve common inverter design requirements.
They explore the benefits and construction of these modules and how you can take
advantage of them in your next design.
Click here for more information about Infineon Technologies EconoDUAL™ 3 IGBT
Modules
May 19, 2023
1,174 views
Nexperia Energy Harvesting Solutions
Sponsored by Mouser Electronics and Nexperia
Energy harvesting is a great way to ensure a sustainable future of electronics
by eliminating batteries and e-waste. In this episode of Chalk Talk, Amelia
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Littelfuse Protection IC (eFuse)
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If you are working on an industrial, consumer, or telecom design, protection ICs
can offer a variety of valuable benefits including reverse current protection,
over temperature protection, short circuit protection, and a whole lot more. In
this episode of Chalk Talk, Amelia Dalton and Pete Pytlik from Littelfuse
explore the key features of protection ICs, how protection ICs compare to
conventional discrete component solutions, and how you can take advantage of
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Click here for more information about Littelfuse Protection eFuse ICs
May 8, 2023
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Sponsored by Mouser Electronics and Microchip
In this episode of Chalk Talk, Amelia Dalton and Shishir Malav from Microchip
explore the benefits of the PIC32CX-BZ2 and WBZ45 Multi-protocol Wireless MCU
Family and how it can make IoT design easier than ever before. They investigate
the components included in this multi-protocol wireless MCU family, the details
of the software architecture included in this solution, and how you can utilize
these MCUs in your next design.
Click here for more information about the Microchip Technology WBZ451 Curiosity
Board
May 4, 2023
4,543 views
Chalk Talk Archive →

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